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A molecular dynamics simulation and validation of bonding behavior evolution between epoxy and aluminum-doped silica substrate under water environment
更新时间：2023-11-24

    • A molecular dynamics simulation and validation of bonding behavior evolution between epoxy and aluminum-doped silica substrate under water environment

    • Journal of Civil and Environmental Engineering   Vol. 43, Issue 5, Pages: 123-131(2021)

    • DOI：10.11835/j.issn.2096-6717.2021.042    

      CLC：

    • Received：09 January 2021，

      Published：2021-10

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  • Huamiao SONG, Zuquan JIN, Pan WANG, et al. A molecular dynamics simulation and validation of bonding behavior evolution between epoxy and aluminum-doped silica substrate under water environment[J]. Journal of Civil and Environmental Engineering, 2021, 43(5): 123-131. DOI： 10.11835/j.issn.2096-6717.2021.042.

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